Executive Chairman and Director
Arjun Gupta is the Executive Chairman at CALIENT and has been the key investor in CALIENT for two decades. In addition, Arjun is the Chief Believer and founder of Telesoft Partners (www.telesoftvc.com), a special situations venture capital firm in Silicon Valley. Over the last twenty‑five years, he has invested in and helped build over 100+ technology companies, of which over 60+ companies have been acquired or gone public (combined market cap over $750 billion). Recognizable brands include DocuSign, Salesforce.com, T-Mobile USA, Uber and others. He was on the Forbes Midas List of Top-100 Venture Investors in 2006, 2007, 2008, 2009. Prior to Telesoft, Arjun was at McKinsey & Company where his clients included Apple, AT&T/PacBell, Verizon/PacTel and others. He was part of the Digital Transition Project for LA which launched Qualcomm CMDA against the industry standard of TDMA. He was also part of the Paradigm Project which led to the spinoff of General Magic from Apple. He started his career at Tektronix Inc, initially as an operating systems software engineer, then a field applications engineer and finally a product specialist covering new product introductions in the US, Germany and Japan. Arjun loves developing and scaling great technology products.
In 2001, Arjun launched a family foundation to support education, conservation and the performing arts. The foundation has supported over 100 projects in America, India and Africa. Arjun is a Trustee of Aspen Institute and the Aspen Music Festival. He is a co-founder and co-chair of YPO Gold Aspen. Arjun is an avid outdoorsman and has skied to the North Pole and to the South Pole and was recently appointed a UN Mountain Partnership Ambassador to help with climate change initiatives. Since 2013, Arjun has been a member of the new ownership group of the Sacramento Kings NBA basketball team.
Arjun received his MBA from Stanford University, an MS and BS (Phi Beta Kappa) in computer science from WSU, and a BA (Honors) in economics from St Stephen’s College (India). He is an ALI Fellow at Harvard University and a Henry Crown Fellow at the Aspen Institute. Arjun lives in San Francisco and Aspen.
Phil is a founding member and has been a partner with Cayuga Venture Fund (CVF) since 1996. He is also a Founding Managing Partner of Integrated Acquisition & Development (IAD), a private equity investor. He has been a principal investor in a number of technology-based businesses prior to CVF, including companies in the development of cellular MSA and RSA markets, as well as in companies with expertise in artificial intelligence for industrial applications. Phil was a key investor in Kionix, a leading 3D-MEMs vendor, which was acquired by CALIENT and by Rohm (Japan) in a series of transactions valued at over $500 million. Phil began his career as a Financial Analyst and Consultant after studying Engineering Physics at Cornell University. He is based in Ithaca, NY, and serves on a number of boards affiliated with Cornell University, the Paleontological Research Institution, and several other organizations.
Dave Rickey is a recognized leader from the semiconductor industry. Dave was CEO of AMCC for nearly a decade, taking AMCC public and subsequently through an acquisition. Over the years, he has served on a number of public and private boards. Most recently, he served as Chairman of the Board of Cytori Theraputics (NASDAQ: CYTX). Dave is actively engaged in philanthropy through the Brenda & Dave Rickey Foundation. Prior to AMCC, Dave held senior management positions at NextGen, Nortel and IBM. Dave has an MS in Materials Science from Stanford University, a BS in Metallurgy from Columbia Engineering and a BS in Mathematics from Marietta College.
Sun Jiexiao (Jack Sun) served as Chairman of the Board and General Manager at Suzhou Chunxing Precision Mechanical Co. Ltd (Chunxing). Chunxing is a leading company principally engaged in the manufacturing of precision aluminum and magnesium alloy structures as well as 3D glass and plastic structures for the telecommunications, consumer electronics/IT, automobile and industrial market segments. Chunxing’s products mainly include precision die casting products, machining products, 3D glass products, stamping sheet metal parts and plastic injection parts. Chunxing is also engaged in the business of designing, manufacturing and distributing RF conditioning products for wireless telecommunication infrastructure. Jack has also served on the Boards of nine other companies, including a leading private electric car manufacturer in China.